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Investigation of substrate bias effects on the reactively sputtered ZrN diffusion barrier films

机译:衬底偏压对反应溅射ZrN扩散阻挡膜影响的研究

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ZrN diffusion barrier films were prepared by DC reactive magnetron sputtering under different negative substrate bias. The composition, microstructure, resistivity and diffusion barrier properties of ZrN films, with respect to substrate bias, were studied by means of X-ray diffraction, electron probe microanalyzer, Auger electron spectroscopy, and four point probe method. Results showed that the deposition rate and impurity oxygen content of ZrN films were substantially influenced by the resputtering effects due to the ion bombardment on the film surface. The competition between surface energy and strain energy made the preferred orientation of ZrN films change from (1 1 1) to (2 0 0) and then back to highly (1 1 1) preferred orientation as a function of substrate bias. The application of negative substrate bias could effectively decrease the electrical resistivity due to the decrease of impurity oxygen content and the densification of films, resulting from the moderate-energy ion irradiation. The biased ZrN films could successfully be used as a diffusion barrier layer, between Cu and SiO_2, even up to the high temperature of 800 deg C for 30 min.
机译:在不同的负衬底偏压下,通过直流反应磁控溅射制备ZrN扩散阻挡膜。借助X射线衍射,电子探针显微分析仪,俄歇电子能谱和四点探针法研究了ZrN薄膜的成分,微观结构,电阻率和扩散阻挡层性能与衬底偏压的关系。结果表明,ZrN薄膜的沉积速率和杂质氧含量受薄膜表面离子轰击的重溅射影响很大。表面能和应变能之间的竞争使ZrN薄膜的首选取向从(1 1 1)变为(2 0 0),然后又根据基材的偏斜回到高度(1 1 1)首选取向。施加负的衬底偏压可以有效降低电阻率,这是由于中等能量的离子辐照导致杂质氧含量降低和薄膜致密化所致。偏置的ZrN薄膜可以成功地用作Cu和SiO_2之间的扩散阻挡层,甚至可以在800摄氏度的高温下持续30分钟。

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