SUBSTRATE HOLDING MECHANISM FOR FILM FORMING DEVICE BY BIAS SPUTTERING, CONDUCTANCE CONTROL VALVE FOR VACUUM DEVICE AND SUSCEPTOR ELECTRODE FOR FILM FORMING DEVICE BY BIAS SPUTTERING

摘要

PURPOSE: To transmit the potential impressed to a substrate holding member to a substrate to be worked with good reproducibility and stability by improving the electrical contact between the substrate to be worked and the substrate holding member. ;CONSTITUTION: An annular contact member 7 formed of a conductive metal is mounted by means of plural pieces of screws 10, 11 to the outer periphery of a wafer holder 2. Plural notches (not shown in Fig.) are mounted to the bottom end of the contact member 7, by which plural contact pieces 8 are formed. The plural contact pieces 8 are respectively curved toward the outer side and the respective bottom ends are projected from the rear surface of the wafer holder 2. A wafer 5 is pressed to the rear surface of the wafer holder 2 and the plural contact pieces 8 by rising an arm 4 at the time of sputtering, and the voltage impressed to the wafer holder 2 is uniformly transmitted in this state to the wafer 5 via the rear surface of the wafer holder 2 and the plural contact pieces 8.;COPYRIGHT: (C)1994,JPO&Japio