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首页> 外文期刊>Optik: Zeitschrift fur Licht- und Elektronenoptik: = Journal for Light-and Electronoptic >Morphologies of porous silicon etched by the electrochemical etching method with alcohols additives
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Morphologies of porous silicon etched by the electrochemical etching method with alcohols additives

机译:醇类添加剂电化学腐蚀法腐蚀多孔硅的形貌

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摘要

Several porous silicon (PS) films with macropores are fabricated by electrochemical etching method using five different monohydric normal alcohol additives without any illumination. The experiment results show that as the number of carbon atoms increases, the branch length elongates, the pore density decreases because the ability of anisotropic etching of the solution is enhanced gradually and the space charge region (SCR) width of PS becomes larger. Furthermore, except for methanol (MeOH) and n-pentanol (n-PeOH), with the increasing number of carbon atoms in alcohol, the main pore size deceases and the depth increase because the isotropy becomes weaker. PS in MeOH has small main pore size and large depth because most of charges accumulated at the bottom of pores and promote the growth of the depth. PS in n-PeOH has a small depth because of its strong hydrophobicity property, which hinders the etching at the length direction. These experimental results demonstrate the important role of alcohols on the dissolution kinetics with silicon, which has a direct impact on the pore growth process. (C) 2015 Elsevier GmbH. All rights reserved.
机译:通过电化学蚀刻方法,使用五种不同的一元正醇添加剂,无需任何照明,即可制备出具有大孔的多孔硅(PS)薄膜。实验结果表明,随着碳原子数的增加,支链长度延长,孔密度减小,这是因为溶液的各向异性刻蚀能力逐渐增强,PS的空间电荷区(SCR)宽度变大。此外,除了甲醇(MeOH)和正戊醇(n-PeOH)以外,随着醇中碳原子数的增加,各向同性变弱,主要孔径减小,深度增大。 MeOH中的PS具有较小的主孔径和较大的深度,这是因为大多数电荷积累在孔的底部并促进深度的增长。 n-PeOH中的PS由于其强的疏水性而具有较小的深度,这阻碍了在长度方向上的蚀刻。这些实验结果证明了醇对硅的溶解动力学的重要作用,这直接影响了孔的生长过程。 (C)2015 Elsevier GmbH。版权所有。

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