首页> 外文会议>2012 International Conference on Enabling Science and Nanotechnology >Effects of etching time on the morphology of porous silicon structure formed by potential-assisted electrochemical etching
【24h】

Effects of etching time on the morphology of porous silicon structure formed by potential-assisted electrochemical etching

机译:刻蚀时间对电势电化学刻蚀形成的多孔硅结构形貌的影响

获取原文
获取原文并翻译 | 示例

摘要

Several parameters such as doping concentration and crystal orientation of the substrate, electrolyte composition, applied current density and etching time play an important role in the electrochemistry of silicon [1–4]. However, illumination is another major parameter in Si etching process, particularly for n-type material [5]. In this paper, porous silicon (PS) structures were prepared under front-side illumination of UV light (12 W) at various etching times. The evolution of pore structures as a function of etching time has been investigated. The fabricated PS samples show clear four-branching structure suggesting that etching enhances in <001> and <010> directions faster than <100> direction. This pore deformation can be described by the proposed three consecutive phases based on the current burst model [6–7].
机译:诸如衬底的掺杂浓度和晶体取向,电解质成分,施加的电流密度和蚀刻时间等几个参数在硅的电化学中起着重要的作用[1-4]。然而,照明是硅蚀刻过程中的另一个主要参数,特别是对于n型材料[5]。在本文中,在紫外光(12 W)的正面照射下,以不同的蚀刻时间制备了多孔硅(PS)结构。已经研究了孔结构随蚀刻时间的变化。制成的PS样品显示清晰的四分支结构,表明在<001>和<010>方向上的蚀刻增强速度快于<100>方向。可以根据当前的爆裂模型[6-7],通过提出的三个连续相来描述这种孔隙变形。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号