首页>
外国专利>
The structure which was formed with the method of using the etching medicine and that etching medicine which possess the selectivity for the silicon dioxide which is on top of the silicon dioxide and nitriding silicon of non dope and is doped, and that.
The structure which was formed with the method of using the etching medicine and that etching medicine which possess the selectivity for the silicon dioxide which is on top of the silicon dioxide and nitriding silicon of non dope and is doped, and that.
The etching medicine which as for x integer of 2 or 5, as for y with integer of 1 or 4, as for x+y 6 is, consists of C2 H xF y etches silicon dioxide which are doped than non dope silicon dioxide and nitriding silicon selectively. Therefore, in the dry etching method which uses the etching medicine which consists of C2 H xF y, non dope silicon dioxide and nitriding silicon it can be used as the etching stop material. C2 H xF y can be used as a basic etching medicine, or as the additive of the other etching medicine and the mixed etching medicine. Being based on the etching medicine of this invention, and the method of this invention the semiconductor device which includes the structure which patterning is done (10) it disclosed. The silicon dioxide structure which concretely, most vertical side walls (34) possesses this invention and, is doped (24) with, the side wall (34) approaching, the semiconductor device which includes with the structure of non dope silicon dioxide and the nitriding silicon which it exposes (10) it consists of.
展开▼
机译:x的整数为2或5,y的整数为1或4,x + y的腐蚀药物为C 2 Sub> H xF y 与未掺杂的二氧化硅相比,对掺杂的二氧化硅进行刻蚀可以选择性地进行氮化。因此,在使用由C 2 Sub> H xF y Sub>,非掺杂二氧化硅和氮化硅组成的蚀刻药物的干蚀刻方法中,可以用作蚀刻停止层。材料。 C 2 Sub> H xF y Sub>可用作基本蚀刻剂,或用作其他蚀刻剂和混合蚀刻剂的添加剂。 (10)公开了基于本发明的蚀刻剂和本发明的方法的半导体装置,该半导体装置具有进行图案形成的结构(10)。具体而言,最垂直的侧壁(34)具有本发明的二氧化硅结构,在侧壁(34)接近时被掺杂(24),该半导体器件包括非掺杂二氧化硅和氮化结构。它所暴露的硅(10)组成。
展开▼