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Chemlok adhesive systems for bonding lightweight substrates

机译:Chemlok粘合剂体系,用于粘合轻质基材

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摘要

Interest in engineered thermoplastics will continue to grow across the rubber-to-substrate bonding markets for industrial, aerospace and automotive component manufacturers. In the automotive industry especially, manufacturers and tier suppliers will be challenged to reduce vehicle weight to comply with stricter guidelines for fuel efficiency. The substitution of heavier substrates, where possible, with lighter engineered thermoplastics should improve vehicle fuel efficiency.
机译:在工业,航空航天和汽车零部件制造商的橡胶-基底粘合市场上,对工程热塑性塑料的兴趣将继续增长。尤其是在汽车行业,制造商和供应商将面临减少车辆重量以符合更严格的燃油效率准则的挑战。在可能的情况下,用较轻的工程热塑性塑料代替较重的基材应可提高车辆的燃油效率。

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