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Thermal, mechanical and optical transport properties of nanocomposite materials based on triethoxysilane-terminated polyimide and TiO2 nanoparticles

机译:基于三乙氧基硅烷封端的聚酰亚胺和TiO2纳米粒子的纳米复合材料的热,机械和光学传输性质

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In the preparation of polymer based nanocomposites (NCs), compatibility between the organic phase and inorganic nanoparticles as the filler can be improved by a variety of methods, such as functionalizing polymer chains at their ends, adding a coupling agent to bond the polymer chains and inorganic network etc. In this study, several novel polyimide/titanium dioxide nanocomposites (PI/TiO2 NCs) were prepared by the incorporation of TiO2 nanoparticles into silane terminated PI. To this point, 3-(bis(4-aminophenyl)amino)benzonitrile as a diamine monomer was first synthesized and then it was reacted with an excess amount of 4,4'-(hexafluoroisopropylidene) diphthalic anhydride. The triethoxysilane terminal groups were introduced by reacting the anhydride end-groups of the polymer with (3-aminopropyl)-triethoxysilane. Different hybrid materials based on the silane-terminated PI with inorganic TiO2 network were successfully fabricated by thermal imidization. The resulting materials were characterized by different techniques. According to the transmission electron microscopy images, the TiO2 nanoparticles were well dispersed into the PI matrix with a particle size around 20-40 nm. The resulting composite's mechanical, optical and thermal properties are effectively enhanced by the incorporation of 8 wt% TiO2 nanoparticles. According to the thermogravimetric analysis curves, the T-5% of the NC was increased with the TiO2 loading and approximately a 63 degrees C improvement in T-5% is found. The tensile strength of the hybrid films is significantly increased compared with the pure PI.
机译:在聚合物基纳米复合材料(NCs)的制备中,有机相和作为填充剂的无机纳米颗粒之间的相容性可以通过多种方法来提高,例如在聚合物链的末端官能化,添加偶联剂以键合聚合物链和在这项研究中,通过将TiO2纳米粒子掺入硅烷封端的PI中,制备了几种新型的聚酰亚胺/二氧化钛纳米复合材料(PI / TiO2 NCs)。至此,首先合成了作为二胺单体的3-(双(4-氨基苯基)氨基)苯甲腈,然后使其与过量的4,4'-(六氟异亚丙基)二邻苯二甲酸酐反应。通过使聚合物的酸酐端基与(3-氨基丙基)-三乙氧基硅烷反应来引入三乙氧基硅烷端基。通过热酰亚胺化成功制备了基于硅烷封端的PI与无机TiO2网络的不同杂化材料。所得材料通过不同技术表征。根据透射电子显微镜图像,TiO2纳米颗粒很好地分散在PI基质中,粒径约为20-40 nm。通过掺入8 wt%的TiO2纳米颗粒,可以有效地增强所得复合材料的机械,光学和热性能。根据热重分析曲线,随着TiO2的加入,NC的T-5%升高,并且T-5%的含量提高了约63摄氏度。与纯PI相比,杂化膜的拉伸强度显着提高。

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