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Effects of stirring on the bulk etch rate of LR 115 detector

机译:搅拌对LR 115检测器整体蚀刻速率的影响

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The effects of stirring on the bulk etch rate of LR 115 detector has been investigated. The surface profile measurement method using an instrument called Form Talysurf has been used to measure the thickness of the active layer of the LR 115 detectors. The etchant was 10% aqueous solution of NaOH maintained at 60degreesC. The bulk etch rate under magnetic stirring has been found to be 6.65 +/- 0.34 mum h(-1) and that under no stirring to be 3.61 +/- 0.14 mum h(-1). The initial thickness of the active layer before etching also varies. (C) 2003 Elsevier Science Ltd. All rights reserved. [References: 18]
机译:研究了搅拌对LR 115检测器整体蚀刻速率的影响。使用称为Form Talysurf的仪器进行的表面轮廓测量方法已用于测量LR 115检测器的活性层厚度。蚀刻剂是保持在60℃的10%的NaOH水溶液。已经发现,在磁力搅拌下的整体蚀刻速率为6.65 +/-0.34μmh(-1),在没有搅拌下的整体蚀刻速率为3.61 +/-0.14μmh(-1)。蚀刻之前的有源层的初始厚度也变化。 (C)2003 Elsevier ScienceLtd。保留所有权利。 [参考:18]

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