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A semi-analytic approach for direct slicing of free form surfaces for layered manufacturing

机译:用于分层制造的自由形式表面的直接切片的半解析方法

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Purpose - This paper aims to develop an efficient surface-plane intersection (SPI) algorithm for direct slicing of free-form surfaces to be produced by layered manufacturing. Design/methodology/approach - A semi-analytical method for direct slicing has been formulated and tested on Bezier and B-spline surfaces commonly used in CAD modeling. This method solves for the intersection points by a "root" finding procedure and establishes their connectivity, unlike the conventional "marching" procedures. Findings - The proposed algorithm solves intersection contours between free form surfaces and planes. The solution procedure is efficient with respect to computational time and accuracy (feature detection) over some of the conventional SPI strategies. The method involves a global solution procedure in contention with the traditional methodologies which are generally spatially distinctive in approach. Research limitations/implications - Use of higher order terms in the representation of parametric surfaces makes the algorithm computationally intensive and time-expensive. Practical implications - This algorithm would be of practical use in the direct slicing of free form surfaces used in CAD modeling. Direct slicing methods solve for the actual intersection of surface and plane without resorting to "tessellation." Reducing the computation time and detection of features within a given resolution is of primary importance for developing commercial rapid prototyping software, which is achieved in the present paper. Originality/value - A novel method has been developed for SPI for use in direct slicing of CAD models. While a major proportion of the direct slicing strategies employ the "marching" procedure involving determination of "critical points," the proposed method utilizes the evaluation of "roots" of a surface in a global manner to determine the intersection points with proper connectivity. Hence, it is effective in reducing the computation time and is simple but generic in approach. Although Bezier and B-spline surfaces are used as the representative cases, the algorithm can be extended for any parametric surface for direct slicing.
机译:目的-本文旨在开发一种有效的表面-平面相交(SPI)算法,用于对分层制造的自由形状表面进行直接切片。设计/方法/方法-已经在CAD建模中常用的Bezier和B样条曲面上制定了直接切片的半分析方法,并对其进行了测试。与传统的“行进”过程不同,此方法通过“根”查找过程解决了相交点并建立了它们的连通性。结果-所提出的算法解决了自由曲面和平面之间的相交轮廓。该解决方案相对于某些常规SPI策略而言,在计算时间和准确性(特征检测)方面非常有效。该方法涉及与传统方法论相争的整体解决方案,而传统方法学通常在方法上在空间上是独特的。研究的局限性/意义-在参数化曲面的表示中使用高阶项会使算法运算量大且费时。实际意义-该算法将在CAD建模中对自由曲面的直接切片中具有实际用途。直接切片方法可解决表面与平面的实际交点,而无需借助“细分”。在给定的分辨率下,减少计算时间和特征检测对于开发商业快速原型制作软件至关重要,这在本文中是可以实现的。原创性/价值-已为SPI开发了一种新颖的方法,可用于直接对CAD模型进行切片。虽然大部分直接切片策略采用涉及确定“临界点”的“行进”过程,但是所提出的方法以整体方式利用对表面“根”的评估来确定具有适当连通性的交点。因此,它在减少计算时间方面是有效的,并且方法简单但通用。尽管以Bezier和B样条曲面为代表,但该算法可以扩展到任何参数曲面以进行直接切片。

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