Solution-Based Assembly of Conductive Gold Film on Flexible Polymer Substrates

摘要

Conductive films of gold were assembled on flexible polymer substrates such as Kapton and polyethylene using a solution-based process.The polymer substrates were modified by using argon plasma and subsequent coupling of silanes with amino-or mercapto-terminAl groups.These modified surfaces were examined by X-ray photoelectron spectroscopy and contact angle measurements.ColloidAl gold was assembled onto the silane-modified surface from solution.The gold particles are attached to the surface by covAlent interactions with the thiol or amine group.Formation of a conductive film is achieved by increasing the coverage of gold by using a "seeding"method to increase the size of the attached gold particles.Field emission scanning electron microscopy was used to follow the growth of the film.The surface resistance of the films,measured using a four-point probe,was about 1 OMEGA/sq.