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首页> 外文期刊>Materials Technology >KLA-Tencor Introduces ASET-F5X With Advanced Thin Film Measurement Capabilities Down To The 0.1 -Micron Node
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KLA-Tencor Introduces ASET-F5X With Advanced Thin Film Measurement Capabilities Down To The 0.1 -Micron Node

机译:KLA-Tencor推出具有低至0.1微米节点的先进薄膜测量功能的ASET-F5X

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KLA-Tencor, the world leader in yield management and process control solutions for semiconductor manufacturing and related industries, has introduced an enhanced version of its award-winning ASET-F5 thin film measurement system. The new version, known as the ASET-F5x, incorporates a single wavelength ellipsometry (SWE) option to complement the industry-leading spectroscopic ellipsometry (SE) and dual-beam spectrophotometry (DBS) technologies incorporated in the ASET-F5. These combined capabilities provide the accuracy, repeatability and system-to-system matching required for the production of advanced integrated circuits (ICs) with geometries as small as 0.1 micron. In addition, the ASET-F5x is a bridge tool capable of handling either 200 or 300 mm wafers.
机译:KLA-Tencor是半导体制造及相关行业产量管理和过程控制解决方案的全球领导者,它推出了屡获殊荣的ASET-F5薄膜测量系统的增强版。新版本称为ASET-F5x,结合了单波长椭圆仪(SWE)选件,以补充ASET-F5中包含的行业领先的光谱椭圆仪(SE)和双光束分光光度法(DBS)技术。这些综合功能可提供生产尺寸小至0.1微米的高级集成电路(IC)所需的精度,可重复性和系统间匹配。此外,ASET-F5x是一种桥接工具,能够处理200或300毫米的晶片。

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