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Lasing in direct-bandgap GeSn alloy grown on Si

机译:沉积在Si上生长的直接带隙GeSn合金

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Large-scale optoelectronics integration is limited by the inability of Si to emit light efficiently(1), because Si and the chemically well-matched Ge are indirect-bandgap semiconductors. To overcome this drawback, several routes have been pursued, such as the all-optical Si Raman laser(2) and the heterogeneous integration of direct-bandgap III-V lasers on Si3-7. Here, we report lasing in a direct-bandgap group IV system created by alloying Ge with Sn-8 without mechanically introducing strain(9,10). Strong enhancement of photoluminescence emerging from the direct transition with decreasing temperature is the signature of a fundamental direct-bandgap semiconductor. For T <= 90 K, the observation of a threshold in emitted intensity with increasing incident optical power, together with strong linewidth narrowing and a consistent longitudinal cavity mode pattern, highlight unambiguous laser action(11). Direct-bandgap group IV materials may thus represent a pathway towards the monolithic integration of Si-photonic circuitry and complementary metal-oxide-semiconductor (CMOS) technology.
机译:大规模的光电集成受到​​Si无法有效发光的限制(1),因为Si和化学上匹配良好的Ge是间接带隙半导体。为了克服这个缺点,已经采取了几种方法,例如全光学拉曼激光器(2)和直接带隙III-V激光器在Si3-7上的异质集成。在这里,我们报道了在通过带隙将Ge与Sn-8合金化而没有机械引入应变的情况下在直接带隙IV组系统中产生的激射(9,10)。随着温度的降低,直接跃迁引起的光致发光的强烈增强是基本的直接带隙半导体的特征。对于T <= 90 K,随着入射光功率的增加而观察到的发射强度阈值,以及强烈的线宽变窄和一致的纵向腔模模式,突出了明确的激光作用(11)。直接带隙IV族材料因此可以代表通向硅光子电路和互补金属氧化物半导体(CMOS)技术的单片集成的途径。

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