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In situ preparation of an ultra-thin nanomask on a silicon wafer

机译:在硅晶片上原位制备超薄纳米掩模

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Porous nanomasks have been prepared in situ on an insulating silicon wafer by anodization of an aluminum film grown on it. Ultra-thin nanomasks, around 50 nm thick, were fabricated by utilizing a stop signal, a vivid color appearing at the air-electrolyte interface, and the process involved showed excellent repeatability. Finally, 2D nanoscale p-n junction arrays were fabricated on a silicon on insulator (SOI) wafer using the ultra-thin nanomasks prepared. The experimental results are in good agreement with the simulated results on the characteristics of the anodization process involved.
机译:已经通过在其上生长的铝膜进行阳极氧化,在绝缘硅晶片上原位制备了多孔纳米掩模。利用停止信号制造了厚度约为50 nm的超薄纳米掩模,在空气-电解质界面处出现了鲜艳的色彩,并且所涉及的过程显示出出色的可重复性。最后,使用制备的超薄纳米掩模在绝缘体上硅(SOI)晶圆上制造了二维纳米级p-n结阵列。实验结果与阳极氧化工艺特性的模拟结果吻合良好。

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