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SF6 plasma etching of silicon nanocrystals

机译:SF6等离子体蚀刻硅纳米晶体

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An SF6-based plasma has been employed to perform in-flight etching of silicon nanocrystals (Si-NCs) after they were synthesized in an SiH4-based plasma. The photoluminescence of the Si-NCs blue-shifts after etching, indicating an etching-induced size reduction of the Si-NCs. It is shown that both the SF6 plasma power and the flow rate can be utilized to control the etch rate (and thus the size reduction) of the Si-NCs. The SF6 etched Si-NCs show only low concentrations of residual impurities other than fluorine. Quantum yields as high as 50% have been observed from these SF6 etched Si-NCs despite oxidation.
机译:在基于SiH4的等离子体中合成后,基于SF6的等离子体已用于对硅纳米晶体(Si-NC)进行飞行中蚀刻。蚀刻后,Si-NC的光致发光蓝移,表明蚀刻引起的Si-NC尺寸减小。结果表明,SF6等离子体功率和流速均可用于控制Si-NC的蚀刻速率(从而减小尺寸)。 SF6蚀刻的Si-NC仅显示出低浓度的残留杂质(氟除外)。尽管被氧化,但从这些SF6蚀刻的Si-NC中观察到高达50%的量子产率。

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