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Self-limited self-perfection by liquefaction for sub-20 nm trench/line fabrication

机译:20纳米以下沟槽/线制造的液化自我限制自我完善

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摘要

We proposed and demonstrated a new approach to pressed self-perfection by liquefaction (P-SPEL), where a layer of SiO2 is used as a stopper on one sidewall of gratings, to self-limit the final trench width in P-SPEL to a preset stopper layer thickness, allowing a precise control of the final trench width without the need to control any pressing parameters such as pressure, temperature and the gap between the pressing plate and the substrate. We achieved 20 nm wide trenches from a 90 nm original width, reducing the original trench by 450%. We also observed improvement in the trench width uniformity. Using the fabricated resist trenches as templates, 20 nm metal lines were achieved by lift-off.
机译:我们提出并演示了一种通过液化压制自完善(P-SPEL)的新方法,其中将SiO2层用作光栅一个侧壁上的塞子,以将P-SPEL中的最终沟槽宽度自限制为预设的阻挡层厚度,可以精确控制最终沟槽的宽度,而无需控制任何压力参数,例如压力,温度以及压力板与基板之间的间隙。我们从90纳米的原始宽度获得了20纳米的沟槽,将原始沟槽减少了450%。我们还观察到沟槽宽度均匀性的改善。使用制造的抗蚀剂沟槽作为模板,通过剥离获得20 nm金属线。

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