Atomistic simulation of microcrack healing in aluminium

摘要

A molecular dynamics method is used to simulate microcrack healing during heating or under compressive stress. A centre microcrack in Al crystal could be sealed by a critical compressive stress or by heating over a critical temperature. During microcrack healing, dislocation generation and motion occurred. When there were pre-existing dislocations around the microcrack, the critical temperature necessary for microcrack healing would decrease from 850 to 650 K. The critical temperature necessary for microcrack healing depended upon the orientation of the crack plane. For example, the critical temperature of the crack along the (111) plane was the lowest. [References: 17]