The molecular dynamics method is used to simulate microcrack healing during heating or under com- pressive stress. A center microcrack in an Al crystal could be sealed under a critical compressive stress or by heating it over a critical temperature. During microcrack healing, dislocation and vacancy are generated and moved, and some- times twin appears. The critical temperature necessary for microcrack healing depends upon the orientation of the crack plane. For example, the critical temperature of the crack along the (111) plane is the lowest. When there are pre-exist- ing dislocations around the microcrack, the critical temperature necessary for microcrack healing will decrease.
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