Influence of process parameters on the substrate heating in direct current plasma magnetron sputtering deposition process

摘要

Purpose — The purpose of this paper is to address the influence of deposition process parameters. The substrate heating mechanisms are alsodiscussed. Design/methodology/approach — Deposition duration, sputtering power, working gas pressure, and substrate heater temperature on substrateheating in the direct current (DC) magnetron sputtering deposition process were investigated.