首页> 外文期刊>Microsystem technologies >The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers
【24h】

The effect of atmospheric moisture on crack propagation in the interface between directly bonded silicon wafers

机译:大气水分对直接键合硅片之间的界面中裂纹扩展的影响

获取原文
获取原文并翻译 | 示例
           

摘要

Infra-red video sequences were taken of directly bonded silicon wafer pairs undergoing the razor blade crack length bond strength measurement in a specially designed jig. A series of tests were carried out under controlled atmospheres of nitrogen at various relative humidities. Analysis of the video images showed that the crack continues to propagate rapidly for several minutes after the blade has stopped moving, and that the presence of moisture has a strong positive influence on the rate of crack propagation under static loading. A new Maszara protocol is suggested based on modelling crack growth using our experimentally derived constants.
机译:在经过特殊设计的夹具中,对直接粘合的硅晶片对进行了剃须刀裂缝长度粘合强度的测量,获得了红外视频序列。在各种相对湿度的受控氮气氛下进行了一系列测试。对视频图像的分析表明,在刀片停止移动后,裂纹在几分钟内继续迅速传播,并且水分的存在对静态载荷下的裂纹扩展速率具有很强的积极影响。根据使用实验得出的常数对裂纹扩展进行建模,建议使用新的Maszara协议。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号