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Contributions to the Interfacial Adhesion in Co-Sintered Bilayers

机译:对共烧结双层中界面粘合的贡献

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The adhesive strength of co-sintered bilayers is influenced by several factors, including the nature of bonding along the joined interface, residual stresses evolved during processing, and the sintered properties of the individual layers. Here these separate contributions are isolated through careful control of the co-sintering process for W/Al_2O_3 bilayers, and in particular through control of the W-layer properties by using the process of activated sintering. Four-point bending delamination tests are used to evaluate adhesion and strength of the bilayers, and the interfacial fracture mechanics of the system is numerically studied using finite element simulations. Improvements in sintered density are found to increase the adhesive strength of the system only up to a point, beyond which shrinkage mismatch compromises the intrinsic toughness of the interface.
机译:共烧结双层的粘合强度受几个因素影响,包括沿连接界面的粘合性质,加工过程中产生的残余应力以及各个层的烧结性能。在这里,通过仔细控制W / Al_2O_3双层的共烧结过程,特别是通过使用活化烧结过程控制W层特性,可以隔离这些单独的作用。使用四点弯曲分层测试来评估双层的附着力和强度,并使用有限元模拟对系统的界面断裂力学进行数值研究。发现烧结密度的提高仅将系统的粘合强度提高到一定程度,超过该范围收缩率不匹配会损害界面的固有韧性。

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