International Symposium On Physical Simulation

摘要

The first International Symposium on Physical Simulation (ISPS) to be held in the USA has attracted papers from more than 60 researchers around the world. The symposium - scheduled for Columbus, Ohio, 3-5 June, 1996 -is jointly sponsored by Dynamic Systems, Inc., Edison Welding Institute, ASM International, and the Forging Industry Education and Research Foundation. As the sixth ISPS, the Columbus meeting will provide a forum for the exchange of information on physical simulation, including: 8 Physical simulation of hot deformation processes, including forging, rolling, recrystallization, microstructural evolution, and high temperature failure.