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Electronic Transport Properties of Ni-doped CoSb_3 Prepared by Encapsulated Induction Melting

机译:包封感应熔化制备Ni掺杂CoSb_3的电子输运性质

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摘要

Ni-doped CoSb_3 skutterudites were prepared by encapsulated induction melting and their thermoelectric and electronic transport properties were investigated. The negative signs of Seebeck and Hall coefficients for all Ni-doped specimens revealed that Ni atoms successfully acted as n-type dopants by substituting Co atoms. The carrier concentration increased as the Ni doping content increased, and the Ni dopants could generate excess electrons. However, the carrier mobility decreased as the doping content increased, which indicates that the electron mean free path was reduced by the impurity scattering. The Seebeck coefficient and the electrical resistivity decreased as the carrier concentration increased, as the increase in carrier concentration by doping overcame the decrease in the carrier mobility by impurity scattering. The Seebeck coefficient showed a negative value at all temperatures examined and increased as the temperature increased. The temperature dependence of electrical resistivity suggested that Co_(1-x)Ni_xSb_3 is a highly degenerate semiconducting material. Thermal conductivity was considerably reduced by Ni doping, and the lattice contribution was dominant in the Ni-doped CoSb_3.
机译:通过封装感应熔炼法制备了掺Ni的CoSb_3方钴矿,并研究了其热电和电子输运性能。所有掺Ni的样品的塞贝克系数和霍尔系数的负号表明,Ni原子通过取代Co原子成功地充当了n型掺杂剂。随着Ni掺杂含量的增加,载流子浓度增加,并且Ni掺杂剂会产生过量的电子。然而,载流子迁移率随掺杂含量的增加而降低,这表明电子平均自由程因杂质散射而降低。塞贝克系数和电阻率随着载流子浓度的增加而降低,这是由于掺杂引起的载流子浓度的增加克服了杂质散射引起的载流子迁移率的降低。塞贝克系数在所有检查温度下均显示为负值,并随温度升高而增加。电阻率的温度依赖性表明,Co_(1-x)Ni_xSb_3是高度退化的半导体材料。 Ni掺杂大大降低了热导率,并且在Ni掺杂的CoSb_3中晶格贡献占主导地位。

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