METAL ENCAPSULATION MATERIAL HAVING EXCELLENT HEAT DISSIPATION PROPERTY, FORMING METHOD THEREOF, AND FLEXIBLE ELECTRONIC DEVICE ENCAPSULATED BY SAME METAL ENCAPSULATION MATERIAL

摘要

The present invention relates to a metal encapsulation material having an excellent heat dissipation property, a forming method thereof, and a flexible electronic device encapsulated by the metal encapsulation material and, more specifically, to a metal encapsulation material comprising one surface on which a coating layer, including a metal-graphite composite material, is formed, thereby having excellent flexibility, workability, a heat dissipation property, and a water resistance property, and a forming method thereof, and a flexible electronic device encapsulated by the metal encapsulation material.;COPYRIGHT KIPO 2016