Software Package for Semiconductor Manufacturing Equipment, MAGNIGEM Pro/Pro300, MAGNILOG

摘要

Meidensha Corporation has developed and released the next-generation host communication software package by the name of MAGNIGEM Pro/Pro300, to be introduced below. At the same time, the Company has also accomplished the version upgrading of the software package products "MAGNILOG", and intends to use them for the platform structuring of the Equipment Engineering System (EES). Details about this achievement are also introduced below.