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首页> 外文期刊>Materials science in semiconductor processing >High-performance SOI MESFET with modified depletion region using a triple recessed gate for RF applications
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High-performance SOI MESFET with modified depletion region using a triple recessed gate for RF applications

机译:高性能SOI MESFET,具有改良的耗尽区,使用三重凹入式栅极实现RF应用

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摘要

A novel SOI MESFET with the modified depletion region using a Triple Recessed Gate (TRG-SOI MESFET) is presented for RF applications. The proposed gate consists of lower and upper gate to control the channel thickness and the depletion layer will change by omitting part of total charge due to locating gate in the channel. The key idea of this shaped gate is to modify the depletion region and the charge distribution of the channel in order to lower the electric field of the device and improving the breakdown voltage. In addition the maximum power density, the maximum oscillation frequency, the cutoff frequency, and the minimum noise figure for the proposed structure are improved due to increasing the drain-source resistance and the transconductance and decreasing the gate resistance. Therefore, the TRG-SOI MESFET can be used for high-power and high frequency applications. (C) 2014 Elsevier Ltd. All rights reserved.
机译:提出了一种新颖的SOI MESFET,其具有使用三重凹槽栅极(TRG-SOI MESFET)的耗尽层修正区。所提出的栅极由上下栅极组成,以控制沟道厚度,并且由于将栅极放置在沟道中而导致总电荷的一部分被省略,因此耗尽层将发生变化。这种成形的栅极的关键思想是修改耗尽区和沟道的电荷分布,以降低器件的电场并提高击穿电压。另外,由于增加了漏极-源极电阻和跨导并减小了栅极电阻,因此改善了所提出结构的最大功率密度,最大振荡频率,截止频率和最小噪声系数。因此,TRG-SOI MESFET可用于大功率和高频应用。 (C)2014 Elsevier Ltd.保留所有权利。

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