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All-(lll) surface silicon nanowire field effect transistor devices: Effects of surface preparations

机译:全(III)表面硅纳米线场效应晶体管器件:表面处理的影响

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Etching/hydrogen termination of All-(111) surface silicon nanowire field effect (SiNW-FET) devices developed by conventional photolithography and plane dependent wet etchings is studied with X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), atomic force microscopy (AFM) and electrical and electrochemical measurements. All measurements were carried out before and after etching with 1% HF, 40% NH_4F, and 40% NH_4F (N_2) solutions and ozone surface treatments. AFM studies showed higher etching rates for the apex of the triangular nanowires. Stability of as prepared hydrogen terminated SiNW-FET surfaces and their electrical conductivity were considered. Surface etched devices were operated efficiently in an aqueous 0.02 M KCl solution within a small potential window and a reference electrode was found to be essential. Retention of surface positive charges and inversion of p-type to n-type device character have been discussed.
机译:通过X射线光电子能谱(XPS),扫描电子显微镜(SEM),原子研究了通过常规光刻和与平面相关的湿法刻蚀开发的全(111)表面硅纳米线场效应(SiNW-FET)器件的腐蚀/氢终止力显微镜(AFM)以及电和电化学测量。所有测量均在使用1%HF,40%NH_4F和40%NH_4F(N_2)溶液蚀刻和进行臭氧表面处理之前和之后进行。原子力显微镜研究表明,三角形纳米线顶点的蚀刻速率更高。考虑了所制备的氢封端的SiNW-FET表面的稳定性及其电导率。表面蚀刻的器件在0.02 M KCl水溶液中在较小的电位窗口内有效运行,并且发现参比电极是必不可少的。讨论了表面正电荷的保留以及p型向n型器件特性的反转。

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