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Study of grains size distribution and electrical activity of heavily boron doped polysilicon thin films

机译:重硼掺杂多晶硅薄膜的晶粒尺寸分布和电活性研究

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摘要

The grain size distribution (GSD) and related electrical activity of boron heavily doped amorphous LPCVD thin films were studied according to the heat treatment durations. Results show that GSD approaches a logarithmic-normal form at a short annealing duration and for crystalline fractions around 5%, demonstrating that the crystallization process occurs with depletion nucleation sites; and becomes a pure log-normal for crystalline fractions around 25% after 15 min anneal. The fast change from log-linear to log-normal distribution in the GSD allows boron to acquire its maximum activity during a short annealing duration under 700 1C annealing temperature.
机译:根据热处理时间,研究了硼重掺杂非晶LPCVD薄膜的粒度分布(GSD)和相关的电活性。结果表明,GSD在较短的退火时间内接近对数正态形式,且结晶分数约为5%,表明结晶过程发生在耗尽成核位点。退火15分钟后,对于约25%的结晶级分变为纯对数正态。 GSD中从对数线性分布到对数正态分布的快速变化使硼在700 1C退火温度下的短退火时间内获得了最大活性。

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