'Bottom Package Exposed Die Mems Pressure Sensor Integrated Circuit Package Design' in Patent Application Approval Process (USPTO 20220285249)

摘要

The following quote was obtained by the news editors from the background information supplied bythe inventors: ““Technical Field “The present disclosure generally relates to MEMS (Microelectromechanical Systems) packagesfabricated using a lead frame tape to form a MEMS package with holes that expose a sensing componentto an outside environment, and more particularly to such a package that can be reliably formed with fewfailures and reduced opportunities for packaging errors.