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首页> 外文期刊>Materials transactions >Constituent Element Addition to n-Type Bi2Te2.67Se0.33 Thermoelectric Semiconductor without Harmful Dopants by Mechanical Alloying
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Constituent Element Addition to n-Type Bi2Te2.67Se0.33 Thermoelectric Semiconductor without Harmful Dopants by Mechanical Alloying

机译:机械合金化在无有害掺杂的n型Bi2Te2.67Se0.33热电半导体中添加构成元素

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N-type Bi2Te2.67Se0.33 thermoelectric materials with added constituent elements were prepared without the addition of harmful dopants using mechanical alloying (MA) followed by hot pressing (HP). All the prepared samples were identified from the Bi2Te3-Bi2Se3 solid-solution diffraction peak. They were all single-phase n-type semiconductors. The maximum dimensionless figures of merit, ZT, of Bi2Te2.67(Se-0.33)(1+0.06), Bi-2(Te-2.67)(1+0.06)Se-0.33, and Bi-2(Te2.67Se0.33)(1+0.03) were 0.93 at 440 K, 0.99 at 441 K, and 0.97 at 442 K, respectively. These results indicate that the figure of merit of Bi2Te2.67Se0.33 doped with constituent elements, prepared using the MA-HP process, is nearly same as the highest value, i.e., 1.0, reported in the literature.
机译:使用机械合金化(MA),然后热压(HP),可以在不添加有害掺杂剂的情况下,制备出添加了构成元素的N型Bi2Te2.67Se0.33热电材料。从Bi2Te3-Bi2Se3固溶体衍射峰鉴定出所有制备的样品。它们都是单相n型半导体。 Bi2Te2.67(Se-0.33)(1 + 0.06),Bi-2(Te-2.67)(1 + 0.06)Se-0.33和Bi-2(Te2.67Se0)的最大无量纲品质因数ZT。 33)(1 + 0.03)在440 K下分别为0.93,在441 K下为0.99和在442 K下为0.97。这些结果表明,使用MA-HP工艺制备的掺杂有组成元素的Bi 2 Te 2.67 Se 0.33的品质因数几乎与文献报道的最高值即1.0相同。

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