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A robust method of enhancement of protection ability of electrodeposited silane film over copper surface using H2O2

机译:使用H2O2增强铜表面电沉积硅烷膜保护能力的可靠方法

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摘要

The enhancement of protection of copper through pretreatment of metal surface with H2O2 and subsequent addition of H2O2 in the electrodeposition of 3-mercaptopropyltrimethoxysilane (MPTS) has been investigated in the present work. MPTS films over copper surface with and without H2O2 were investigated by FT-IR, XRD, Raman spectroscopy and SEM. The protection of copper surface by MPTS in the presence and absence of H2O2 in 1% NaCl medium was also investigated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization studies (PDS). The results of the study indicate that MPTS film electrodeposited on pretreated copper with 1000 ppm of H2O2 increases the inhibition efficiency to almost 100%.
机译:在本工作中,已经研究了通过用H2O2预处理金属表面并随后在3-巯基丙基三甲氧基硅烷(MPTS)的电沉积中添加H2O2来增强铜的保护性。通过FT-IR,XRD,拉曼光谱和SEM研究了有和没有H2O2的铜表面上的MPTS膜。还通过电化学阻抗谱(EIS)和电势极化研究(PDS)研究了在1%NaCl介质中存在和不存在H2O2的情况下,通过MPTS对铜表面的保护。研究结果表明,电沉积在含有1000 ppm H2O2的预处理铜上的MPTS膜将抑制效率提高到几乎100%。

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