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Electrochemical aspects of Ti-Ta alloys in HBSS

机译:HBSS中Ti-Ta合金的电化学方面

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Corrosion behaviour of the studied Ti-Ta alloys with Ta contents of 30, 40 and 50wt% together with the currently used metallic biomaterials commercial pure titanium (Cp-Ti) was investigated for biomedical applications. All the samples were tested by potentiodynamic polarization curves and electrochemical impedance spectroscopy (EIS) in Hank's balanced salt solution (HBSS) with and without albumin protein at 25℃. Very low corrosion current densities and passive current densities (in the order of 10~(-6) A/cm~2) were obtained from the polarization curves, indicating a typical passive behaviour for all the samples in HBSS with and without albumin. The EIS technique was applied to study the nature of the passive film formed on all the samples at various imposed potentials -500mV (SCE), 0mV (SCE), 500mV (SCE) and 1000mV (SCE). The equivalent circuit (EC) used successfully to describe the behaviour of the samples suggests a single passive film present on the metals' surface in HBSS with and without albumin. The results showed that the presence of albumin in HBSS had an influence on the zero current potential (ZCP), polarization resistance (R_p) and capacitance (C). The presence of albumin protein in HBSS improved slightly the corrosion resistance of the entire sample. The experimental results confirm that the electrochemical behaviour of the studied Ti-Ta alloys is better to that of Cp-Ti, suggesting their promising potential for biomedical applications.
机译:研究了Ta含量为30、40和50wt%的Ti-Ta合金与当前使用的金属生物材料工业纯钛(Cp-Ti)的腐蚀行为,以用于生物医学应用。在25℃下,在带有和不带有白蛋白的汉克平衡盐溶液(HBSS)中,通过电位动力学极化曲线和电化学阻抗谱(EIS)测试所有样品。从极化曲线获得了非常低的腐蚀电流密度和无源电流密度(约为10〜(-6)A / cm〜2),表明在有和没有白蛋白的HBSS中,所有样品的典型无源行为。 EIS技术用于研究在所有施加电势-500mV(SCE),0mV(SCE),500mV(SCE)和1000mV(SCE)的所有样品上形成的钝化膜的性质。成功用于描述样品行为的等效电路(EC)表明,存在或不存在白蛋白的HBSS金属表面上均存在单个钝化膜。结果表明,HBSS中白蛋白的存在对零电流电位(ZCP),极化电阻(R_p)和电容(C)有影响。 HBSS中白蛋白的存在会稍微改善整个样品的耐腐蚀性。实验结果证实,所研究的Ti-Ta合金的电化学行为优于Cp-Ti,表明它们在生物医学应用中具有广阔的发展前景。

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