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Ti-Ta ALLOY SPUTTERING TARGET AND PRODUCTION METHOD THEREFOR
Ti-Ta ALLOY SPUTTERING TARGET AND PRODUCTION METHOD THEREFOR
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机译:Ti-Ta合金溅射靶及其制备方法
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摘要
A Ti-Ta alloy sputtering target containing 0.1 to 30 at% of Ta, and remainder being Ti and unavoidable impurities, wherein the Ti-Ta alloy sputtering target has an oxygen content of 400 wtppm or less. The present invention has a favorable surface texture with a low oxygen content and is readily processable due to its low hardness, and therefore the present invention yields a superior effect of being able to suppress the generation of particles during sputtering.
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