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Fabrication of SMD 32.768 kHz tuning fork-type crystals: photolithography and selective etching of an array of quartz tuning fork resonators

机译:SMD 32.768 kHz音叉型晶体的制造:光刻和石英音叉谐振器阵列的选择性蚀刻

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Negative photoresist photolithography was used to etch array of quartz tuning forks for use in Qualcomm mobile station modem (MSM)-3000 central processing unit (CPU) chips of code division multiple access (CDMA), personal communication system (PCS), and global system for mobile communication (GSM) units. It was found superior to positive photoresist photolithography. Quartz tuning fork blanks with optimum shock-resistant characteristics were designed using finite element method (FEM) and processing condition was devised for reproducible precision etching of Z-cut quartz wafer into array of tuning forks. Tuning fork pattern was transferred via ordinary photolithographical chromium/quartz glass template using a standard single-sided aligner and subsequent negative photoresist development. Tightly adhering and pinhole-free 600/2000 A chromium/gold mask is coated over the developed photoresist pattern which was subsequently stripped in acetone. This procedure was repeated on the backside of the wafer. With protective metallization area of tuning fork geometry thus formed, etching through quartz wafer was done at 80 ℃ in a ±1.5 ℃ controlled bath containing concentrated solution of ammonium bifluoride to remove unwanted area of the quartz wafer. Surface finish of quartz wafer prior to etching and the quality of quartz crystals used primarily affected the quality of quartz wafer surface finish after quartz etching. At 80 ℃, selective etching of 100 μm quartz wafer could be effected within 90 min. Reproducible precision selective etching method has thus been established and enables mass production of miniature tuning fork resonators photolithographically.
机译:负光刻胶光刻用于蚀刻石英音叉阵列,用于码分多址(CDMA),个人通信系统(PCS)和全局系统的Qualcomm移动站调制解调器(MSM)-3000中央处理器(CPU)芯片中用于移动通信(GSM)单元。发现优于正性光刻胶光刻。使用有限元方法(FEM)设计了具有最佳抗冲击性能的石英音叉毛坯,并设计了加工条件,以将Z切石英晶片可重现地精密蚀刻到音叉阵列中。使用标准的单面对准器通过普通的光刻铬/石英玻璃模板转移音叉图案,然后进行负性光刻胶显影。紧密粘合且无针孔的600/2000将铬/金掩模涂在显影的光刻胶图案上,然后在丙酮中剥离。在晶片的背面重复该过程。这样就形成了音叉几何形状的保护性金属化区域,在80°C的±1.5℃受控浴中通过石英晶片进行蚀刻,该浴中含有浓缩的氟化氢铵溶液,以去除石英晶片上不需要的区域。蚀刻前石英晶片的表面光洁度和所用石英晶体的质量主要影响石英蚀刻后石英晶片表面光洁度的质量。在80℃下90分钟内可以选择性刻蚀100μm石英晶片。因此,已经建立了可再现的精密选择性蚀刻方法,该方法能够用光刻技术大量生产微型音叉谐振器。

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