Simulation Method for Connector Packaging

摘要

There is a growing demand for technology that can analyze and test contact reliability with high accuracy in high-pin-count flat packaging such as sockets for central processing units (CPUs) and application specific integrated circuits (ASICs) and in card edge connectors for modular products. We have developed simulation technology for visualizing the behavior of individual contacts, which cannot be obtained empirically. This technology lets engineers test connections in connector packaging and clarify their behavior, enabling the mechanism behind stable contacts to be determined from the desktop without the need to perform numerous experiments. This paper introduces two key examples of applying this technology. First, for land grid array (LGA) connections having a high mating pressure, we clarified the behavior of individual contacts and tested long-term connection reliability while taking into account the package and system (board) displacement over time. Next, for connector packaging for module boards that must secure a mechanical board while also achieving electrical stability in the same contacts, we tested connection safety by clarifying the mechanism of module-board slippage due to vibration during equipment transport.