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首页> 外文期刊>Global SMT & Packaging: European Edition (Surface Mount Technology) >A review of halogen/halide-free test methods and classifications for soldering materials
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A review of halogen/halide-free test methods and classifications for soldering materials

机译:焊接材料的无卤/无卤测试方法和分类综述

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摘要

Over the last few years, there has been an increase in the evaluation and use of halogen-free soldering materials. In addition, there has been increased scrutiny into the level of halogens and refinement of the definition and testing of halogen-free soldering materials. The challenge has been that there has been no common standard across the industry in terms of halogen-free definitions and the corresponding test methods to determine these. This has created confusion in the industry as to what end users want and what soldering materials suppliers can actually provide. This paper reviews the status of halogen-free and halide-free in terms of definitions, test methods and the limitations and accuracy of test methods used to determine if a soldering material is halogen/halide-free or not. The different industry standards, both currently available and in the process of being drafted, are also discussed.
机译:在过去的几年中,无卤素焊接材料的评估和使用有所增加。此外,人们对卤素含量的审查越来越严格,对无卤素焊接材料的定义和测试也进行了改进。面临的挑战是,就无卤素的定义和确定这些定义的相应测试方法而言,整个行业没有统一的标准。对于最终用户想要什么以及供应商可以实际提供的焊接材料,这在业界引起了混乱。本文从定义,测试方法以及用于确定焊接材料是否不含卤素/卤化物的测试方法的局限性和准确性方面回顾了无卤和无卤的状态。还讨论了当前可用和正在起草过程中的不同行业标准。

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