PoP: An EMS perspective on assembly, rework and reliability

摘要

While already in widespread use in the consumer market for handheld, portable electronics, package on package (PoP) continues to gain in popularity and seems likely to be implemented in other types of electronic assemblies. In order to define internal assembly processes for PoP devices, an assembly and reliability study was undertaken. The first goal was to assess the performance of different dip-pable fluxes and solder pastes in terms of assembly yield and quality. The second was to assess the reliability of different variations of the test vehicle under accelerated thermal cycling.