What does X-ray inspection of hidden BGA solder joints reveal?

摘要

Microfocus X-ray inspection has become a generally accepted method to control the quality of board assemblies, and to analyze defects of hidden solder joints. And it is key to efficient implementation and monitoring of the reflow process for BGA, CSP and flip-chip. For optimum exploitation, the right equipment should be operated in an appropriate way, and results be interpreted in light of the assembly process.