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首页> 外文期刊>Engineering Fracture Mechanics >Time-harmonic crack problems in functionally graded piezoelectric solids via BIEM
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Time-harmonic crack problems in functionally graded piezoelectric solids via BIEM

机译:通过BIEM实现功能梯度压电固体中的时谐裂纹问题

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摘要

In-plane crack analysis of functionally graded piezoelectric solids under time-harmonic loading is performed by using a non-hypersingular traction based boundary integral equa-tion method (BIEM). The material parameters are assumed to vary quadratically with both spatial variables. A frequency dependent fundamental solution, as well as its derivatives and asymptotic expressions, is derived in closed-form by using an appropriate algebraic transformation for the displacement vector and the Radon transform. Numerical results for the stress intensity factors (SIFs) are discussed for different examples. The accuracy of the presented method is checked by comparison with available results from the litera-ture. Investigated are the effects of the inhomogeneity parameters, the frequency of the applied electromechanical load and the geometry of the crack scenario on the K-factors.
机译:通过使用基于非超级牵引力的边界积分方程法(BIEM),在时谐载荷下对功能梯度压电固体进行面内裂纹分析。假定材料参数随两个空间变量呈二次方变化。通过对位移矢量使用适当的代数变换和Radon变换,以封闭形式导出频率相关的基本解及其导数和渐近表达式。讨论了不同示例的应力强度因子(SIF)的数值结果。通过与文献中可获得的结果进行比较来检验所提出方法的准确性。研究了不均匀性参数,施加的机电负载的频率以及裂纹情形的几何形状对K因子的影响。

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