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首页> 外文期刊>Electrochimica Acta >Influence of the temperature of film formation on the electronic structure of oxide films of formed on 304 stainless steel
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Influence of the temperature of film formation on the electronic structure of oxide films of formed on 304 stainless steel

机译:成膜温度对在304不锈钢上形成的氧化膜的电子结构的影响

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The semiconducting properties of passive films formed on AISI type 304 stainless steel in borate buffer solution were studied by capacitance (Mott-Schottky approach) and photocurrent measurements. The oxide films formed on 304 stainless steel in air in the temperature range between 50 and 450℃ have also been studied. The results obtained show that, in all cases the electronic structure of the films is comparable to that of a p-n heterojunction in which the space charges developed at the metal-film and film-electrolyte interfaces have also to be considered. This is in accordance with the analytical results showing that the oxide films are in all cases composed of an inner region rich in chromium oxide and an outer region rich in iron oxide. When the temperature of the film formation changes the thickness of the films and the doping densities also change but the model to explain the semiconducting properties of the very thin passive films and the relatively thick well-crystallized thermally grown films is basically the same. To confirm the existence of the heterojunction measurements on thermally grown films before and after the cathodic reduction were also carried out.
机译:通过电容(Mott-Schottky方法)和光电流测量研究了AISI 304不锈钢在硼酸盐缓冲溶液中形成的钝化膜的半导体性能。还研究了在304不锈钢在50至450℃的温度范围内的空气中形成的氧化膜。所获得的结果表明,在所有情况下,薄膜的电子结构都可与p-n异质结的电子结构相媲美,在该结构中,还必须考虑在金属-薄膜和薄膜-电解质界面处产生的空间电荷。根据分析结果表明,在所有情况下,氧化膜均由富含氧化铬的内部区域和富含氧化铁的外部区域组成。当成膜温度改变时,膜的厚度和掺杂密度也改变,但是用于解释非常薄的无源膜和相对厚的充分结晶的热生长膜的半导体性质的模型基本相同。为了证实在进行阴极还原之前和之后对热生长薄膜的异质结测量的存在。

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