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The Modulation of Crystal Originated Pits by the LOCOS Process in 0.25μm SRAM Technology

机译:0.25μmSRAM技术中的LOCOS工艺对晶体坑的调制

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摘要

Crystal originated pits (COPs) were observed onpatterned silicon wafers after local oxidation of silicon (LOCOS)process in 0.25μm static random access memory (SRAM)technology. Most COPs were found located in the narrow activeregion. Design of experiments revealed that the thickness of padoxide, nitride, and field oxide modulate the density of COPs. Thecalculation of hydrostatic stress introduced in the LOCOSprocess showed that the stress generated in the active regioncorrelates with the density of COPs. No correlation of yield tothe COP density was found.
机译:在0.25μm静态随机存取存储器(SRAM)技术中对硅进行局部氧化(LOCOS)工艺后,在图案化的硅片上观察到了晶体起源的凹坑(COPs)。发现大多数缔约方会议位于狭窄的活动区域。实验设计表明,填充氧化物,氮化物和场氧化物的厚度可调节COP的密度。在LOCOS过程中引入的静水应力计算表明,在活性区域中产生的应力与COPs的密度相关。没有发现产率与COP密度相关。

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