Frictional Analysis of Various Poly(vinyl alcohol) Brush Roller Designs for Post-Interlevel Dielectric CMP Scrubbing Applications

摘要

Tribological attributes of a post-chemical mechanical planarization (CMP) brush-scrubbing process are investigated as a function of brush surface design and wafer substrate topography. Two types of brushes with different surface designs are tested on both silicon dioxide blanket wafer and shallow trench isolation patterned wafer substrates. Results show that brush design strongly impacts the frictional and lubrication characteristics of the scrubbing process, which suggests the need for customized brush surface designs for improved cleaning efficiency.