Electrochemical behavior of silver-copper alloys in voltammetry of microparticles: A simple method for screening purposes

摘要

Voltammetry of microparticles (VMP) is used as a tool to identify Ag/Cu alloys. The identification process is based on the position of the voltammetric peaks obtained in different media: ammonia buffer 0.1 M, oxalic acid 0.4 M and thiocyanate 0.4 Mi for samples of Ag, Cu and Ag/Cu alloys, immobilized on a graphite electrode. The phases and structure of four Ag/Cu alloys (91:9, 70:30, 40:60, 10:90) sew studied by scanning electron microscopy (SEM) and then related to the voltammograms to establish a relationship between structure and peak share and position. [References: 28]