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Investigating the impact of the defect dynamic characteristics on the PBTI in the high-kappa gate device

机译:缺陷动态特性对高κ栅极器件PBTI的影响研究

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摘要

Recent device reliability studies on the metal/high-kappa device observed the inter-convertible characteristics of the electron trap levels between the shallow and deep defect states under cyclic positive-bias temperature stressing. Although the oxygen vacancy and oxygen interstitial defect, being two typical types of defects in the high-kappa oxide, have been criticized as the culprit for the device reliability issue and investigated in many simulations, all results have indicated that the defect levels induced by them were either too shallow or too deep and failed to explain the above experimental observation. Nevertheless, studies on the static characteristics of vacancy-interstitial (V-O-O-i) model showed scattering distributed electron trap levels within the bandgap, making it as a promising defect type that can account for the above experimental observation. In this work, we investigated the dynamic characteristics of the V-O-O-i defect pair under PBTI stress by tuning the relative position of V-O and O-i. Our simulation results show multiple energy barriers for the structure transformation along the O-i migration path, and the charge trap level of the specific defect pair during the O-i migration is shown to be adjustable within the HfO2 band gap, depending on the O-i positions. These results depict an atomic picture to help us understand the defect electrical behavior under cyclic positive bias stress condition.
机译:最近对金属/高κ器件的器件可靠性研究观察了循环正偏置温度应力下浅层和深层缺陷态之间电子阱能级的可转换特性。尽管氧空位和氧间质缺陷是高κ氧化物中两种典型的缺陷类型,被批评为器件可靠性问题的罪魁祸首,并在多次模拟中进行了研究,但所有结果都表明,它们引起的缺陷水平要么太浅,要么太深,未能解释上述实验观察结果。然而,对空位间隙(V-O-O-i)模型静态特性的研究表明,带隙内存在散射分布的电子阱能级,使其成为一种很有前途的缺陷类型,可以解释上述实验观察结果。本文通过调节V-O和O-i的相对位置,研究了PBTI应力下V-O-O-i缺陷对的动态特性。仿真结果表明,沿O-i迁移路径的结构转变存在多个能垒,并且O-i迁移过程中特定缺陷对的电荷阱电平在HfO2带隙内是可调的,具体取决于O-i位置。这些结果描绘了一幅原子图,有助于我们理解循环正偏置应力条件下的缺陷电行为。

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