Industry experts answer EP&P readers' questions.

摘要

Whenever there is a thin cover-plating of gold or any other soluble plating, the solderability of the base metal underneath becomes of primary importance. So a specification on the gold is not the answer. To explain, a thin gold flash (2-8 micro-inches thick) will rapidly dissolve in the molten solder, and leave the base metal underneath exposed to the solder. If this surface is solderable by itself, you get good wetting.