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Ultrafine pitch QFPs remain as a popular high I/O package type

机译：超细间距QFP仍是流行的高I / O封装类型

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《Electronic Packaging and Production》 |1998年第7期|共1页
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Electronic Packaging and Production Group;
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1. Ultrafine pitch QFPs remain as a popular high I/O package type [J] . Electronic Packaging and Production Group Electronic Packaging and Production . 1998,第7期

机译：超细间距QFP仍是流行的高I / O封装类型
2. 296 lead fine pitch (0.4 mm) thin plastic QFP package with TAB interconnect [J] . Jain P. IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging . 1995,第3期

机译：带有TAB互连的296引脚细间距（0.4 mm）薄塑料QFP封装
3. 296 lead fine pitch (0.4 mm) thin plastic QFP package with TABinterconnect [J] . Jain P. IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1995,第3期

机译：带有TABinterconnect的296引脚细间距（0.4 mm）薄塑料QFP封装
4. 296 lead fine pitch (0.4 mm) thin plastic QFP package with TAB interconnect [C] . Jain, P. Electronic Components and Technology Conference, 1994. Proceedings., 44th . 1994

机译：带有TAB互连的296引脚细间距（0.4 mm）薄塑料QFP封装
5. Optimization of Manufacturing Process to Eliminate Head-In Pillow (HiP) Defect on a Fine Pitch (0.4mm) Package-on-Package Device. [D] . Bakare, Sugadh Nilraj. 2017

机译：优化制造工艺，以消除细间距（0.4mm）层叠封装器件上的枕形枕（HiP）缺陷。
6. Benchmark of four popular virtual screening programs: construction of the active/decoy dataset remains a major determinant of measured performance [O] . Ludovic Chaput, Juan Martinez-Sanz, Nicolas Saettel, 2016

机译：四个流行的虚拟筛选程序的基准：主动/诱饵数据集的构建仍然是衡量性能的主要决定因素
7. Critical variables of solder paste stencil printing for micro-BGA and fine-pitch QFP [O] . Pan, Jianbiao, Tonkay, Gregory L., Storer, Robert H., 2004

机译：微型BGA和细间距QFP的锡膏模版印刷的关键变量
8. Thermal Conductivity Reduction in p-type Si80Ge20 Alloys due to Ultrafine BN Particulates [R] . Vandersande, Jan W., Fleurial, Jean-Pierre, Scoville, Nancy, 1993

机译：由超细BN颗粒引起的p型si80Ge20合金的热导率降低

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