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首页> 外文期刊>Electrophoresis: The Official Journal of the International Electrophoresis Society >Modeling of misalignment effects in microfluidic interconnects for modular bio-analytical chip applications
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Modeling of misalignment effects in microfluidic interconnects for modular bio-analytical chip applications

机译:用于模块化生物分析芯片应用的微流体互连中的未对准效应建模

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Minimizing misalignments during the interconnection of microfluidic modules is extremely critical to develop a fully integrated microfluidic device. Misalignments arising during chip-to-chip or world-to-chip interconnections can be greatly detrimental to efficient functioning of microfluidic devices. To address this problem, we have performed numerical simulations to investigate the effect of misalignments arising in three types of interconnection methods: (i) end-to-end interconnection (ii) channel overlap when chips are stacked on top of each other, and (iii) tube-in-reservoir misalignment occurring due to the offset between the external tubing and the reservoir. For the case of end-to-end interconnection, the effect of misalignment was investigated for 0, 13, 50, 58, and 75% reduction in the available flow area at the location of geometrical misalignment. In the channel overlap interconnection method, various possible misalignment configurations were simulated by maintaining the same amount of misalignment (75% flow area reduction). The effect of misalignment in a tube-in-reservoir interconnection was investigated by positioning the tube at an offset of 164 μm from the reservoir center. All the results were evaluated in terms of the equivalent length of a straight pipe. The effect of Reynolds number (Re) was also taken into account by performing additional simulations of aforementioned cases at Re ranging between 0.075 ≤ Re ≤ 75. Correlations were developed and the results were interpreted in terms of equivalent length (Le). Equivalent length calculations revealed that the effect of misalignment in tube-in-reservoir interconnection method was the least significant when compared to the other two methods of interconnection.
机译:在开发微流控模块时,最大程度地减少未对准是开发完全集成的微流控设备的关键。在芯片到芯片或世界到芯片的互连期间产生的未对准可能对微流体装置的有效功能有极大的损害。为了解决这个问题,我们进行了数值模拟以研究三种类型的互连方法中产生的未对准的影响:(i)端到端互连(ii)芯片堆叠在一起时通道重叠,并且( iii)由于外部管道和储层之间的偏移,导致储层中的储层管未对准。对于端到端的互连,研究了未对准的影响,即在几何未对准的位置处,可用流动面积减少了0、13、50、58和75%。在通道重叠互连方法中,通过保持相同数量的未对准(减少了75%的流动面积)来模拟各种可能的未对准配置。通过将管放置在距储层中心164μm的偏移处,研究了储层管内互连中未对准的影响。所有结果均以直管的等效长度进行评估。通过对上述情况在0.075≤Re≤75之间的Re处进行上述情况的附加模拟,还考虑了雷诺数(Re)的影响。建立了相关性,并以等效长度(Le)来解释结果。等效长度计算表明,与其他两种互连方法相比,管中管互连方法中未对准的影响最小。

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