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首页> 外文期刊>Solid-State Electronics >The effect of thermal treatment on the characteristic parameters of Ni/-, Ti/- and NiTi alloy/n-GaAs schottky diodes
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The effect of thermal treatment on the characteristic parameters of Ni/-, Ti/- and NiTi alloy/n-GaAs schottky diodes

机译:热处理对Ni/-、Ti/-和NiTi合金/正氮化镓肖特基二极管特性参数的影响

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摘要

Ni/-. Ti/- and NiTi alloy/n-GaAs Schottky barrier diodes (SBDs) have been fabricated And annealed for 5 min in the temperature range of l00-650℃ with steps of 50 or 100℃ The value ofфb and n for as-deposited Ni/-, Ti/- and NiTi alloy/n-GaAsSBDs has been determined to be 0.73, 0.64 and 0.68 eV and 1.02, 1.08 and 1.10. respectively. For the NiTi alloy/n-GaAs diode, while the ideality factor remains unchanged up to 400℃ annealing, it decreased to 1.02 at 500℃. An additional barrier heightenhancement with increased annealing temperature occurs while the ideality factor remains close to unity. Thermal stability of the NiTi alloy/n-GaAs diode is maintained up to an annealing temperature of 500 C. It has been concluded that the NiTialloy/n-GaAs SBD contact has a better performance than the Ni/- and Ti/n-type.
机译:镍/-。Ti/- 和 NiTi 合金/n-GaAs 肖特基势垒二极管 (SBD) 已制成,并在 l00-650°C 的温度范围内以 50 或 100°C 的步长退火 Ni/-、Ti/- 和 NiTi 合金/n-GaAsSBD 的 фb 和 n 值已被确定为 0.73、0.64 和 0.68 eV 以及 1.02、1.08 和 1.10。分别。对于NiTi合金/正氧化镓二极管,虽然理想系数在400°C退火时保持不变,但在500°C时降至1.02。随着退火温度的升高,势垒高度也会增加,而理想因子仍然接近统一。NiTi合金/正氮化镓二极管的热稳定性可在500°C的退火温度下保持。已经得出结论,NiTialloy/n-GaAs SBD触点比Ni/-和Ti/n型具有更好的性能。

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