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Micromechanical model for cohesive materials based upon pseudo-granular structure

机译:基于伪颗粒结构的粘性材料微机械模型

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A micromechanical model for cohesive materials is derived by considering their underlying microstructure conceptualized as a collection of grains interacting through pseudo-bonds. The pseudo-bond or the inter-granular force-displacement relations are formulated taking inspiration from the atomistic-level particle interactions. These force-displacement relationships are then used to derive the incremental stiffnesses at the grain-scale, and consequently, obtain the sample-scale stress-strain relationship of a representative volume of the material. The derived relationship is utilized to study the stress-strain and failure behavior including the volume change and "brittle" to "ductile" transition behavior of cohesive materials under multi-axial loading condition. The model calculations are compared with available measured data for model validation. Model predictions exhibit both quantitative and qualitative consistency with the observed behavior of cohesive material.
机译:粘性材料的微机械模型是通过考虑其潜在的微观结构而得出的,这些微观结构被概念化为通过伪键相互作用的晶粒集合。拟键或晶间力-位移关系是在原子级粒子相互作用的启发下制定的。然后将这些力-位移关系用于导出晶粒度的增量刚度,并因此获得材料代表体积的样品尺度应力-应变关系。利用推导的关系研究在多轴载荷条件下粘性材料的应力应变和破坏行为,包括体积变化和“脆性”到“延性”的转变行为。将模型计算与可用的测量数据进行比较以进行模型验证。模型预测与观察到的粘性材料行为表现出定量和定性一致性。

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