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Lattice pressure creating and annihilating superconducting subperoxides

机译:晶格压力产生并消除超导过氧化物

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The involvement of O- in oxide superconductivity is indicated in a variety of phenomenological rules such as a universal scaling of T-c with stoichiometric holes per O. Here, a crystal chemistry of O- creation and placement is developed, based on the competition of various types of planes (CuO2, E, B1). Generally, cuprate structural stability is dictated by slab matching, conventionally expressed in tolerance factors (t). Electronic liquefaction through subperoxide formation can ameliorate t, indicating a decisive influence of lattice pressure on the limits of O- formation. Comparison of calculation with experiment indicates trends to lattice commensurable hole patterns, of which the one responsible for optimal T-c is an alternate hole charge order (P2), for both simple and complex cuprates. For complex cuprates, tension on the layers containing M = Bi, Hg, T1 leads to additional reductive self-dopings. Calculations indicate that in optimally doped materials this leads universally to P2. The T-c decreases beyond this optimal doping, usually referred to as "overdoping," are here related to overfilling of this pattern. An extreme case of this occurs with nonsuperconducting Bi2Sr2CuO6, which appears to be P1. This overdoping is caused by severe lattice pressure causing the annihilation of superconducting pairs. A distinction has to be made with a second type of "early" T-c decreases. They occur before attainment of P2 and are due to an unfavorable hole placement crystal chemistry. An example is the disorder in [(LaSr)(2)CuO4]. T-c optimization involves navigating between these antagonistic principles. (C) 2002 Elsevier Science. [References: 16]
机译:O-在氧化物超导中的参与在各种现象学规则中得到了表明,例如Tc随化学计量孔每O的Tc的普遍缩放。在此,根据各种类型的竞争,发展了O-生成和放置的​​晶体化学平面(CuO2,E,B1)。通常,铜酸盐的结构稳定性由平板匹配决定,通常以公差系数(t)表示。通过过氧化物形成的电子液化可以改善t,这表明晶格压力对O-形成极限的决定性影响。计算结果与实验结果的比较表明,晶格具有可比性的孔型趋势,其中简单和复杂的铜价,负责最佳T-c的是交替的孔电荷阶数(P2)。对于复杂的铜酸盐,包含M = Bi,Hg,T1的层上的张力会导致额外的还原性自掺杂。计算表明,在最佳掺杂的材料中,这通常导致P2。 T-c下降到超出此最佳掺杂的水平,通常称为“过量掺杂”,此处与该图案的过量填充有关。这种极端情况发生在非超导Bi2Sr2CuO6上,它似乎是P1。这种过量掺杂是由严重的晶格压力引起的,该晶格压力导致超导对的an灭。必须区分第二种类型的“早期” T-c减小。它们发生在获得P2之前,并且是由于不利的空穴放置晶体化学性质所致。一个例子是[(LaSr)(2)CuO4]中的疾病。 T-c优化涉及在这些对立原则之间进行导航。 (C)2002 Elsevier科学。 [参考:16]

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