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Surface formation characteristics in elliptical ultrasonic assisted grinding of monocrystal silicon

机译:椭圆超声辅助研磨单晶硅的表面形成特性

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The characteristics of surface formation in elliptical ultrasonic assisted grinding (EUAG) of monocrystal silicon were investigated by grinding and single abrasive scratching experiments. In grinding experiments, an elliptical ultrasonic vibrator, on which a thin sheet shaped monocrystal silicon substrate was attached, was installed on a CNC surface grinder equipped with a diamond grinding wheel. By contrast, the vibrator attached with the substrate was set up on a multi-axis CNC controlled machining centre equipped with a single diamond tool to perform the scratching tests. The obtained results show that the grinding forces are reduced by 30%, the surface quality is improved significantly and the surface roughness is decreased by around 25% during EUAG compared with those in conventional grinding without ultrasonic vibration. There is a transition of material removal mode from the permanent contact to the unsuccessive contact between workpiece and abrasive by increasing the ratio of ultrasonic vibration amplitude to the depth of cut.
机译:通过磨削和单磨擦划痕实验研究了单晶椭圆超声辅助磨削(EUAG)中表面形成的特征。在研磨实验中,将椭圆形超声振动器安装在装有金刚石砂轮的CNC平面磨床上,椭圆形超声振动器上附着有薄片状单晶硅基板。相比之下,将附着有基板的振动器安装在配备有单个金刚石工具的多轴CNC控制的加工中心上,以执行划痕测试。所得结果表明,与没有超声振动的常规磨削相比,EUAG磨削力降低了30%,表面质量显着提高,表面粗糙度降低了约25%。通过增加超声振动幅度与切削深度的比值,材料去除模式将从永久性接触过渡到工件与磨料之间的不成功接触。

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